NeoPad Technologies Corp. Lands $14,000,000 Series C Round
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Link http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=fb92b8f5-a38b-4f52-be91-30712374442c&Preview=1
Date 6/27/2008
Company Name NeoPad Technologies Corp.
Mailing Address 7425 NW Evergreen Parkway Hillsboro, OR 97124
Company Description Neopad Technologies Corporation offers specific application CMP pad technology to meet the challenging CMP polishing performance requirements for next generation IC and HDD designs. Our innovative solo pad design provides significant performance advantages which leads to improved yields and lower cost of ownership savings to our customers. Neopad Technologies has established a very strong management and application team to support our customers in providing a totally integrated polishing solution. The company has established several strategic partnerships in both technology and manufacturing and is backed by a very strong and committed group of investors.