Bump Technologies Secures $16,000,000 Series B Financing Round

Feed Type
Link
http://www.venturedeal.com/Search/SearchResultTransactionDetail.aspx?TransactionId=6e3d08e2-b5ef-4699-866c-7d2b5817b6ac&Preview=1
Date
1/11/2011
Company Name
Bump Technologies
Mailing Address
Undisclosed Mountain View, CA 94041
Company Description
Bump is a quick and easy way to connect two phones by simply bumping them together. Exchange your phone number, photos, or compare friends with just a bump.
Website
http://www.bumptechnologies.com
Transaction Type
Venture Equity
Transaction Amount
$16,000,000
Transaction Round
Series B
Proceeds Purposes
This round of financing solidifies our priorities to build a world-class engineering and product organization here in Silicon Valley.
M&A Terms
Venture Investor
Andreessen Horowitz
Venture Investor
Sequoia Capital
Venture Investor
Sherpalo Ventures
Venture Investor
SV Angel