Wire Labs Obtains $1,245,000 New Financing Round

  • Feed Type
  • Date
    11/25/2013
  • Company Name
    Wire Labs
  • Mailing Address
    1118 Broadway E Seattle, WA 98102
  • Company Description
    The company is developing as yet unspecified technologies in the mobile market space.
  • Website
    http://www.wire.im
  • Transaction Type
    Debt
  • Transaction Amount
    $1,245,000
  • Transaction Round
    Undisclosed
  • Proceeds Purposes
    Proceeds purposes were not disclosed. SEC regulatory filing. Contact technology company for solicitation details, if applicable.
  • M&A Terms
  • Venture Investor
    Undisclosed