Tela Innovations Lands $5,500,000 Series C Round

  • Feed Type
  • Date
    12/17/2008
  • Company Name
    Tela Innovations
  • Mailing Address
    655 Campbell Technology Parkway Campbell, CA 95008-5061
  • Company Description
    Tela Innovations offers a next-generation solution for designing advanced semiconductors in the ‘sub wavelength,’ low k 1 era – 45nm and beyond. The Tela solution uses on-grid, straight line, one dimensional layout structures to produce a lithography-optimized layout. The result of using Tela’s pre-defined, predictable topologies is significant improvements in variability, performance, leakage and area.
  • Website
    http://www.tela-inc.com
  • Transaction Type
    Venture Equity
  • Transaction Amount
    $5,500,000
  • Transaction Round
    Series C
  • Proceeds Purposes
    The company plans to use the money to commercialize its semiconductor designs, aimed at efficiently scaling their processes.
  • M&A Terms
  • Venture Investor
    Cadence Design Systems
  • Venture Investor
    KT Venture Group
  • Venture Investor
    Qualcomm, Inc.